Time Travel: 2014

“In 2013, China’s integrated circuit imports amounted to US$231.3 billion.

The strong domestic market demand is also a powerful driving force for the development of China's integrated circuit industry. my country has the world's largest and fastest-growing integrated circuit market, with a scale of 916.6 billion yuan in 2013, accounting for about 50% of the global market share. With the transformation of my country's economic development model, the accelerated adjustment of the industrial structure, and the simultaneous development of new industrialization, informatization, urbanization, and agricultural modernization, the deep integration of industrialization and informatization, and the vigorous promotion of information consumption, the demand for integrated circuits will increase significantly. , the market size is expected to reach 1.2 trillion yuan by 2015.

At present, the global integrated circuit industry has entered a period of major adjustment and transformation, which not only brings challenges to the development of my country's integrated circuit industry, but also provides a rare opportunity for catching up. In the new historical period, the Promotion Outline serves as the action plan to guide the development of China's integrated circuit industry in the future and is of great significance in accelerating industrial development.

In recent years, driven by the market and supported by policies, my country's integrated circuit industry has developed rapidly and its overall strength has significantly improved. However, it cannot be ignored that problems such as the lack of core technologies that restrict the development of my country's integrated circuit industry and the difficulty of products meeting market demand are still very prominent.

The reasons are as follows: First, corporate financing bottlenecks are prominent. Backbone enterprises have poor self-hematopoietic function and high domestic financing costs. Social capital also lacks willingness to invest due to the large amount of investment in the integrated circuit industry and the relatively long return cycle. Second, the company’s continuous innovation capabilities are not strong. There is a lack of leading talents, and companies are small and scattered; the industry's R\u0026D investment is less than one-sixth of that of Intel alone. Third, industrial development is out of touch with market demand. The collaborative pattern of the chip-software-complete machine-system-information service industry chain has not yet been formed, and the advantages of the domestic demand market cannot be fully utilized.

In addition, the imperfect policy environment that adapts to the characteristics of the industry is also an important reason for the weak industrial competitiveness. Through the implementation of the Promotion Outline, it is necessary to solve the above problems and create a good environment for industrial development...

... From the perspective of the development focus of several sub-industries, in terms of the design industry, the layout is carried out around the industrial chain. The recent focus is on core technologies and products of mobile intelligence and network communications to enhance the core competitiveness of the information technology industry; step up the deployment of cloud computing, Use key chips and software for the Internet of Things and big data to innovate business models and seize the commanding heights of future industrial development; gradually break through the application of core chips and software in smart grids, smart transportation, financial electronics and other industries by field and category. In terms of manufacturing, Seize the favorable opportunity of technological change, break through investment and financing bottlenecks, accelerate the construction of advanced production lines, improve comprehensive capabilities, and establish a sustainable profit model. At the same time, take into account the development of unique processes. In the packaging and testing industry, improve chip-level packaging and wafer-level packaging , through silicon vias, three-dimensional packaging and other advanced packaging and testing technology levels to expand scale. In the equipment and materials industry, strengthen the combination of equipment, materials and processes, and develop key equipment such as photolithography machines, etching machines, and ion implanters. Develop key materials such as photoresist and large-size silicon wafers to quickly form supporting capabilities.

This official document has a clear timetable, according to the progress stated in the document:

... Taking the global industrial development trend and domestic industrial foundation as the starting point, the three-stage industrial development goals for 2015, 2020 and 2030 are proposed. By 2015, the mechanism and system innovation will achieve results, and the laws of the integrated circuit industry will be established. Adaptable management decision-making system, financing platform and policy environment. By 2020, gradually narrow the gap with the international advanced level, and basically build a technologically advanced, safe and reliable integrated circuit industry system. By 2030, the industry as a whole will reach the internationally advanced level level and achieve leapfrog development.”